1. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
پدیدآورنده : sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
کتابخانه: Central Library of Amirkabir University of Technology (Tehran)
موضوع : Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
رده :
TK
7870
.
15
.
A85
1995
2. Electrical performance of electronic packaging
پدیدآورنده :
کتابخانه: Central Library and Document Center of Shahid Madani University of Azarbayjan (East Azarbaijan)
موضوع : Electronic packaging congresses,Materials - Electronic properties congresses
رده :
TK
,
7870
.
15
,.
E383
